Bumped Die Production (WLCSP)

Wafer Level Chip Scale Package(WLCSP) How to set AOI machine to inspect bumped die wafer

• Bumped Wafer Probing
• Back Grinding Wafer taping
  Machine http://www.lintec-usa.com/products-bg.cfm
• Wafer Back-Grinding
• Back Grinding Wafer Detaping
  Machine http://www.lintec-usa.com/products-bg.cfm
• Wafer mounting on Film Frame
  Machine http://www.longhill-ind.com/
• UV Cure
• Dicing Saw
  Machine http://www.disco.co.jp/eg/products/dicer/index.html
• AOI
  Machine http://www.rudolphtech.com/
• Die Sorting
  Machine http://www.laurierinc.com/
  Machine http://www.muehlbauer.de
• VM
• Packaging and shipping